STANDARDS

• Protocol support:
  • FC-AL, FC-AL2, FC-PH, FC-PH2, FC-PI,FCP-SSP (SAS-2.0)
• Interoperability:
  • Connects to any FC-AL compliant device
  • Compatible with the InSpeed API
  • Compatible with previous generation InSpeed SOCs and FibreSpy Embedded Storage Switches
  • Supports the attachment of SAS drives to any port using FCP-SSP bridging
  • Connection to SAS expanders and SAS initators is not supported
  • Enables 2.5” small form factor (SFF) disk drives

ARCHITECTURE

• 32 FC ports or SAS Phy functionality
• Peripheral interfaces:
  • Parallel bus microprocessor interface or I²C Interface for access to internal registers
  • LED interface for drives (choice of either legacy 2-line serial interface, or SGPIO interface)
  • GPIO pins
  • JTAG test interface
• Scalability:
  • Up to ten (10) InSpeed SOCs

ADVANCED FEATURES

• Drive support:
  • FC (4/2 Gb/s), SAS (6/3 Gb/s) or SATA (6/3 Gb/s via protocol bridge)
• Disk Drive Workload Management & Monitoring:
  • Disk Drive Workload Management ensures disk drives are not used beyond their design points to improve drive and system reliability
• S.M.A.R.T. Drive Attribute support:
  • Provides S.M.A.R.T. attribute support function to poll any drive’s S.M.A.R.T. attribute data
• Advanced State Capture:
  • Advanced State Capture is a comprehensive set of techniques for continuously collecting system state data that is likely to be useful for failure analysis
• Trunking (patent pending):
  • Trunking fully multiples inter-switch bandwidth with failover pathing, dynamic load balancing and device prioritization
• Zoning:
  • Zoning is port-based non overlapping
  • Supports up to 16 non-overlapping zones
• Dual FC Switching Zones:
  • Supports two-switching zones (zone 0 and 1)
• Speed agility:
  • Provides independent speed control for each port
  • Supports FC speeds of 8, 4, and 2Gb/s
  • Supports SAS speeds of 6.0 and 3.0Gb/s
• Bandwidth Aggregation:
  • Bandwidth Aggregation allows data traffic from lower speed devices to be aggregated into bandwidth capacity available on higher speed backbone connections
• Stability:
  • Stealth Intelligent Change Manager automatically minimizes state and configuration change notification disruptions
  • Zone and port-based management
• Integration:
  • Processor Virtual Port (PVP) is a virtual FC and SAS port that allows the management processor to communicate in-band with attached FC and/or SAS devices
  • Embedded SerDes on each port
  • Selectable termination/swing/equalization per port
  • Serial EEPROM sets system configuration on power-up
  • Reference clock: 106.25 MHz LVTTL

PERFORMANCE

• Switch Latency:
  • Less than 0.2 μSec with no contention, cut‑through routing at 8.5Gb/s
• Performance:
  • Full wire-speed switching
• Aggregate Bandwidth:
  • 51,200MB/s Full Duplex
• Switch Core:
  • Non-blocking any-to-any routing
  • Crossbar switch core dynamically delivers concurrent any-to-any port connections
• Retiming:
  • Architecture ensures jitter compliance and
    cleanest signals
• Fairness and prioritization (patent pending):
  • Ensures all devices have guaranteed access to all other devices, or explicitly have prioritized access

ENCLOSURE MANAGEMENT

• SOC 442 API
• SES API

DIAGNOSTICS

• Continuous Diagnostic Operations:
  • Power on self test, Port Test Before Insertion (PTBI), traffic and utilization monitoring, continuous link health monitoring, clock delta monitoring, pinpoint detection of drive problems, trend monitoring of device behavior, preventative action before failure, automatic port bypass for rogue and unused ports, SAS-2.0 statistic counters
• Diagnostic Troubleshooting Tools:
  • Advanced State Capture, CRC error monitoring & counting, ordered set detectors, counters on every port, ordered set capture, ordered set transmit, port snoop, internal and external loopback, status dump, fault insertion logic, state machine monitoring

POWER

• Nominal:
  • 12.7 Watts (maximum)
  • Power supplies 3.3V / 1.8V / 1.2V

ENVIRONMENTAL

• Temperature:
  • Operating: 0 to 50°C
  • Storage: -40 to 125°C
  • Junction temperature up to 110°C

PHYSICAL

• Package Size:
  • 31mm x 31mm footprint
  • 841 pin BGA flip chip